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车用MOSFET总览

PSMWF008N04NS3-AU

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The PSMWF008N04NS3-AU is a 40 V Gen 3 SGT automotive MOSFET combining PANJIT’s third-generation Shielded-Gate Trench technology with its patented DFN5060SW-8L package. Featuring low RDS(on) of 0.87 mΩ max at VGS = 10 V and a typical total gate charge of 100 nC, it offers a favorable combination of conduction and switching characteristics to support efficient power conversion.

Its high current capability, avalanche performance, and low thermal resistance make it well-suited for automotive DC-DC converters and motor drives. The advanced full-clip package design supports effective thermal management, while Side Wettable Flanks (SWF) enable Automated Optical Inspection (AOI) of solder joints. AEC-Q101 qualified, PPAP capable, and rated for junction temperatures up to 175 °C, it supports demanding automotive power applications.

  • Package

    DFN5060SW-8L

  • Voltage

    40 V

  • Current

    383 A

  • Transistor Polarity

    Single N-Channel

  • Features

    ● Maximum RDS(ON) < 0.87 mΩ at VGS = 10 V
    ● Maximum RDS(ON) < 1.03 mΩ at VGS = 7 V
    ● N channel MOSFET - Standard Level
    ● Excellent FoM (RDS(on) x Qg)
    ● 175 ℃ operating temperature
    ● 100% Avalanche & Rg tested
    ● Patented package with Side Wettable Flanks (SWF)
    for automated optical solder inspection (AOI)
    ● AEC-Q101 qualified and PPAP capable
    ● Lead free in compliance with EU RoHS 2.0
    ● Green molding compound as per IEC 61249 standard

Maximum Ratings and Thermal Characteristics (TJ = 25°C unless otherwise specified)

PARAMETER SYMBOL LIMIT UNITS
Drain-Source Voltage VDS 40 V
Gate-Source Voltage VGS ±20 V
Continuous Drain Current TC=25 °C
TC=75 °C
TC=100 °C
ID 383
312
271
A
Pulsed Drain Current TC=25 °C, tP≤100 us IDM 1500 A
Power Dissipation TC=25 °C
TC=75 °C
TC=100 °C
PD 242
161
121
W
Continuous Drain Current TA=25 °C
TA=75 °C
TA=100 °C
ID 55
44.9
38.9
A
Power Dissipation TA=25 °C
TA=75 °C
TA=100 °C
PD 5
3.3
2.5
W
Body Diode Continuous Current TC=25 °C IS 239 A
Body Diode Pulse Current TC=25 °C, tP≤100 us ISM 1500 A
Single Pulse Avalanche Current IAS 64 A
Single Pulse Avalanche Energy IAS=32 A, limited by TJ_MAX EAS 636 mJ
Operating Junction and Storage Temperature Range TJ, TSTG -55~175 °C

Thermal Characteristics

PARAMETER SYMBOL MIN. TYP. MAX. UNIT
Thermal Resistance
Junction to Ambient
RθJA - 30 - °C/W
Thermal Resistance
Junction to Case
RθJC - 0.48 0.62 °C/W
Thermal Resistance
Junction to Case(TOP)
RθJC_top - - 15 °C/W

Electrical Characteristics (TJ = 25°C unless otherwise specified)

PARAMETER SYMBOL TEST CONDITION MIN. TYP. MAX. UNIT
Static Characteristics
Drain-Source Breakdown Voltage BVDSS VGS=0 V, ID=1 mA 40 - - V
Gate Threshold Voltage VGS(TH) VDS=VGS, ID=250 μA 2.2 2.7 3.2 V
Drain-Source ON Resistance RDS(ON) VGS=10 V, ID=40 A
VGS=7 V, ID=20 A
-
-
0.72
0.79
0.87
1.03
mΩ
Zero Gate Voltage Drain Current IDSS VDS=40 V, VGS=0 V
VDS=40 V, VGS=0 V, TJ=125 °C
-
-
-
-
1
100
μA
Gate-Source Leakage Current IGSS VGS=±20 V, VDS=0 V - - ±100 nA
Gate Resistance Rg f=1 MHz - 1.4 - Ω
Transfer Characteristics gfs VDS=5 V, ID=40 A - 150 - S
Dynamic Characteristics
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Ciss
Coss
Crss
VDS=20 V, VGS=0 V, f=1 MHz -
-
-
6550
2030
135
8515
2639
203
pF
Output Charge Qoss VDD=20 V, VGS=0 V - 71 - nC
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Threshold Gate Charge
Switching Charge
Qg
Qgs
Qgd
Qg(th)
Qsw
VDD=20 V, ID=40 A, VGS=0~10 V -
-
-
-
-
100
27
16
17
26
130
35
24
-
-
nC
Gate Plateau Voltage Vplateau VDD=20 V, ID=40 A, VGS=0~10 V - 4.1 - V
Total Gate Charge, sync. FET Qg(sync) VDD=0.1 V, ID=40 A, VGS=0~10 V - 84 - nC
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
td(on)
tr
td(off)
tf
VDD=20 V, VGS=10 V, ID=40 A, RG=3 Ω -
-
-
-
20
13
62
19
-
-
-
-
ns
Body Diode
Diode Forward Voltage VSD IS=40 A, VGS=0 V - 0.8 0.96 V
Reverse Recovery Charge Qrr IS=40 A, di/dt=100 A/μs - 30 - nC
Reverse Recovery Time Trr IS=40 A, di/dt=100 A/μs - 29 - ns
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